[1] Bondareva, N.S. and M.A. Sheremet, Numerical study of PCMs arrangement effect on heat transfer performance in plate-finned heat sink for passive cooling system. Journal of Thermal Analysis and Calorimetry, 2022. 147(19): p. 10305-10317.
[2] Chu, Y.-M., S. Bilal, and M.R. Hajizadeh, Hybrid ferrofluid along with MWCNT for augmentation of thermal behavior of fluid during natural convection in a cavity. Mathematical Methods in the Applied Sciences, 2020. n/a(n/a).
[3] Mathew, V.K. and T.K. Hotta, Experimental investigation of substrate board orientation effect on the optimal distribution of IC chips under forced convection. Experimental Heat Transfer, 2021. 34(6): p. 564-585.
[4] Shahsavar, A., et al., Numerical investigation of forced convection heat transfer and flow irreversibility in a novel heatsink with helical microchannels working with biologically synthesized water-silver nano-fluid. International Communications in Heat and Mass Transfer, 2019. 108: p. 104324.
[5] da Rosa, O.C., et al., Enhancing heat rejection from electronic devices with a supercritical carbon dioxide minichannel heat exchanger. International Journal of Refrigeration, 2019. 106: p. 463-473.
[6] Manova, S., et al., Cooling of high heat flux electronic devices using ultra-thin multiport minichannel thermosyphon. Applied Thermal Engineering, 2020. 169: p. 114669.
[7] Liu, X., Y. Chen, and M. Shi, Dynamic performance analysis on start-up of closed-loop pulsating heat pipes (CLPHPs). International Journal of Thermal Sciences, 2013. 65: p. 224-233.
[8] Qu, J., et al., Recent advances in MEMS-based micro heat pipes. International Journal of Heat and Mass Transfer, 2017. 110: p. 294-313.
[9] Khalid, S.U., et al., Heat pipes: progress in thermal performance enhancement for microelectronics. Journal of Thermal Analysis and Calorimetry, 2021. 143(3): p. 2227-2243.
[10] Marri, G.K. and C. Balaji, Effect of phase change temperatures and orientation on the thermal performance of a miniaturized PCM heat sink coupled heat pipe. Experimental Heat Transfer, 2022: p. 1-23.
[11] Chen, A., et al., Experimental study on bubble characteristics of time periodic subcooled flow boiling in annular ducts due to wall heat flux oscillation. International Journal of Heat and Mass Transfer, 2020. 157: p. 119974.
[12] Yin, L., et al., Water flow boiling in a partially modified microgap with shortened micro pin fins. International Journal of Heat and Mass Transfer, 2020. 155: p. 119819.
[13] Malý, M., et al., Effect of nanoparticles concentration on the characteristics of nanofluid sprays for cooling applications. Journal of Thermal Analysis and Calorimetry, 2019. 135(6): p. 3375-3386.
[14] Zhao, J., et al., Thermal management strategy for electronic chips based on combination of a flat-plate heat pipe and spray cooling. International Journal of Heat and Mass Transfer, 2021. 181: p. 121894.
[15] Khan, U., et al., Radiative mixed convective flow induced by hybrid nanofluid over a porous vertical cylinder in a porous media with irregular heat sink/source. Case Studies in Thermal Engineering, 2022. 30: p. 101711.
[16] Shahsavar, A., et al., Hydrothermal and entropy generation specifications of a hybrid ferronanofluid in microchannel heat sink embedded in CPUs. Chinese Journal of Chemical Engineering, 2021. 32: p. 27-38.
[17] Ibrahim, M., et al., Energetic and exergetic analysis of a new circular micro-heat sink containing nanofluid: applicable for cooling electronic equipment. Journal of Thermal Analysis and Calorimetry, 2021. 145(3): p. 1547-1557.
[18] Alsarraf, J., et al., Numerical investigation on the effect of four constant temperature pipes on natural cooling of electronic heat sink by nanofluids: A multifunctional optimization. Advanced Powder Technology, 2020. 31(1): p. 416-432.
[19] Al-Rashed, A.A.A.A., et al., Numerical assessment into the hydrothermal and entropy generation characteristics of biological water-silver nano-fluid in a wavy walled microchannel heat sink. International Communications in Heat and Mass Transfer, 2019. 104: p. 118-126.
[20] Al-Rashed, A.A.A.A., et al., Numerical investigation of non-Newtonian water-CMC/CuO nanofluid flow in an offset strip-fin microchannel heat sink: Thermal performance and thermodynamic considerations. Applied Thermal Engineering, 2019. 155: p. 247-258.
[21] Khattak, Z. and H.M. Ali, Air cooled heat sink geometries subjected to forced flow: A critical review. International Journal of Heat and Mass Transfer, 2019. 130: p. 141-161.
[22] Ali, H.M., Recent advancements in PV cooling and efficiency enhancement integrating phase change materials based systems – A comprehensive review. Solar Energy, 2020. 197: p. 163-198.
[23] Muneeshwaran, M., et al., Performance improvement of photovoltaic modules via temperature homogeneity improvement. Energy, 2020. 203: p. 117816.
[24] Rostami, Z., et al., Enhancing the thermal performance of a photovoltaic panel using nano-graphite/paraffin composite as phase change material. Journal of Thermal Analysis and Calorimetry, 2022. 147(5): p. 3947-3964.
[25] Li, Z., et al., Numerical modeling of a hybrid PCM-based wall for energy usage reduction in the warmest and coldest months. Journal of Thermal Analysis and Calorimetry, 2021. 144(5): p. 1985-1998.
[26] Shahsavar, A., et al., Melting and solidification characteristics of a double-pipe latent heat storage system with sinusoidal wavy channels embedded in a porous medium. Energy, 2019. 171: p. 751-769.
[27] Shahsavar, A., et al., Numerical study of melting and solidification in a wavy double-pipe latent heat thermal energy storage system. Journal of Thermal Analysis and Calorimetry, 2020. 141(5): p. 1785-1799.
[28] Shahsavar, A., et al., Entropy and thermal performance analysis of PCM melting and solidification mechanisms in a wavy channel triplex-tube heat exchanger. Renewable Energy, 2021. 165: p. 52-72.
[29] Khalilmoghadam, P., A. Rajabi-Ghahnavieh, and M.B. Shafii, A novel energy storage system for latent heat recovery in solar still using phase change material and pulsating heat pipe. Renewable Energy, 2021. 163: p. 2115-2127.
[30] Wang, T., et al., Approaches for expedition of discharging of PCM involving nanoparticles and radial fins. Journal of Molecular Liquids, 2021. 329: p. 115052.
[31] Tariq, H.A., et al., Hydro-thermal performance of normal-channel facile heat sink using TiO2-H2O mixture (Rutile–Anatase) nanofluids for microprocessor cooling. Journal of Thermal Analysis and Calorimetry, 2021. 145(5): p. 2487-2502.
[32] Sriharan, G., S. Harikrishnan, and H. Ali, Experimental investigation on the effectiveness of MHTHS using different metal oxide-based nanofluids. Journal of Thermal Analysis and Calorimetry, 2021. 143(2): p. 1251-1260.
[33] Li, F., et al., Melting process of nanoparticle enhanced PCM through storage cylinder incorporating fins. Powder Technology, 2021. 381: p. 551-560.
[34] Ghaneifar, M., et al., Mixed convection heat transfer of AL2O3 nanofluid in a horizontal channel subjected with two heat sources. Journal of Thermal Analysis and Calorimetry, 2021. 143(3): p. 2761-2774.
[35] Tariq, S.L., et al., Nanoparticles enhanced phase change materials (NePCMs)-A recent review. Applied Thermal Engineering, 2020. 176: p. 115305.
[36] Rashidi, S., et al., A review on potentials of coupling PCM storage modules to heat pipes and heat pumps. Journal of Thermal Analysis and Calorimetry, 2020. 140(4): p. 1655-1713.
[37] Ahmadlouydarab, M., M. Ebadolahzadeh, and H. Muhammad Ali, Effects of utilizing nanofluid as working fluid in a lab-scale designed FPSC to improve thermal absorption and efficiency. Physica A: Statistical Mechanics and its Applications, 2020. 540: p. 123109.
[38] Ahmadi, A.A., et al., Configuration and Optimization of a Minichannel Using Water–Alumina Nanofluid by Non-Dominated Sorting Genetic Algorithm and Response Surface Method. Nanomaterials, 2020. 10(5).
[39] Zhu, X., et al., Stable microencapsulated phase change materials with ultrahigh payload for efficient cooling of mobile electronic devices. Energy Conversion and Management, 2020. 223: p. 113478.
[40] Ho, J., et al., An experimental investigation of a PCM-based heat sink enhanced with a topology-optimized tree-like structure. Energy Conversion and Management, 2021. 245: p. 114608.
[41] Ren, Q., P. Guo, and J. Zhu, Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite. International Journal of Heat and Mass Transfer, 2020. 149: p. 119199.
[42] Kim, S.H., et al., Enhanced thermal performance of phase change material-integrated fin-type heat sinks for high power electronics cooling. International Journal of Heat and Mass Transfer, 2022. 184: p. 122257.
[43] Lamba, R., et al., PCM-based hybrid thermal management system for photovoltaic modules: A comparative analysis. Environmental Science and Pollution Research, 2023.
[44] Hu, X., et al., Thermal analysis and optimization of metal foam PCM-based heat sink for thermal management of electronic devices. Renewable Energy, 2023. 212: p. 227-237.
[45] Elshaer, A.M., et al., Boosting the thermal management performance of a PCM-based module using novel metallic pin fin geometries: Numerical study. Scientific Reports, 2023. 13(1): p. 10955.
[46] Balakrishnan, R., et al., Analysis of the thermal management of electronic equipment by employing silicon carbide nano-pcm-based heat sink. Environmental Science and Pollution Research, 2023.
[47] Tharwan, M.Y. and H.M. Hadidi, Experimental investigation on the thermal performance of a heat sink filled with PCM. Alexandria Engineering Journal, 2022. 61(9): p. 7045-7054.
[48] Sheikh, Y., M. Fatih Orhan, and M. Kanoglu, Heat transfer enhancement of a bio-based PCM/metal foam composite heat sink. Thermal Science and Engineering Progress, 2022. 36: p. 101536.
[49] Rehman, T.-u., et al., Experimental investigation on the performance of RT-44HC-nickel foam-based heat sinks for thermal management of electronic gadgets. International Journal of Heat and Mass Transfer, 2022. 188: p. 122591.
[50] Manoj Kumar, P., et al., Experimental analysis of a heat sink for electronic chipset cooling using a nano improved PCM (NIPCM). Materials Today: Proceedings, 2022. 56: p. 1527-1531.
[51] Mahmud, H. and D.H. Ahmed, Numerical Investigations on Melting of Phase Change Material (PCM) with Different Arrangements of Heat Source-sink Pairs Under Microgravity. Microgravity Science and Technology, 2022. 34(2): p. 20.
[52] Kim, J., et al., Enhanced thermal performances of PCM heat sinks enabled by layer-by-layer-assembled carbon nanotube–polyethylenimine functional interfaces. Energy Conversion and Management, 2022. 266: p. 115853.
[53] Jalil, J.M., H.S. Mahdi, and A.S. Allawy, Cooling performance investigation of PCM integrated into heat sink with nano particles addition. Journal of Energy Storage, 2022. 55: p. 105466.
[54] Al-Omari, S.A.B., et al., Thermal management characteristics of a counter-intuitive finned heat sink incorporating detached fins impregnated with a high thermal conductivity-low melting point PCM. International Journal of Thermal Sciences, 2022. 175: p. 107396.
[55] Ali, H.M., An experimental study for thermal management using hybrid heat sinks based on organic phase change material, copper foam and heat pipe. Journal of Energy Storage, 2022. 53: p. 105185.
[56] Wang, S., et al., Experimental study on the thermal performance of PCMs based heat sink using higher alcohol/graphite foam. Applied Thermal Engineering, 2021. 198: p. 117452.
[57] Sunku Prasad, J., R. Anandalakshmi, and P. Muthukumar, Numerical investigation on conventional and PCM heat sinks under constant and variable heat flux conditions. Clean Technologies and Environmental Policy, 2021. 23(4): p. 1105-1120.
[58] Hu, X. and X. Gong, Experimental study on the thermal response of PCM-based heat sink using structured porous material fabricated by 3D printing. Case Studies in Thermal Engineering, 2021. 24: p. 100844.
[59] Ho, J.Y., et al., An experimental investigation of a PCM-based heat sink enhanced with a topology-optimized tree-like structure. Energy Conversion and Management, 2021. 245: p. 114608.
[60] Dammak, K. and A. El Hami, Thermal reliability-based design optimization using Kriging model of PCM based pin fin heat sink. International Journal of Heat and Mass Transfer, 2021. 166: p. 120745.
[61] Taghilou, M. and E. Khavasi, Thermal behavior of a PCM filled heat sink: The contrast between ambient heat convection and heat thermal storage. Applied Thermal Engineering, 2020. 174: p. 115273.
[62] Motahar, S. and M. Jahangiri, Transient heat transfer analysis of a phase change material heat sink using experimental data and artificial neural network. Applied Thermal Engineering, 2020. 167: p. 114817.
[63] Gaddala, U.M. and J.K. Devanuri, A Hybrid Decision-Making Method for the Selection of a Phase Change Material for Thermal Energy Storage. Journal of Thermal Science and Engineering Applications, 2020. 12(4).
[64] Debich, B., et al., Design optimization of PCM-based finned heat sinks for mechatronic components: A numerical investigation and parametric study. Journal of Energy Storage, 2020. 32: p. 101960.
[65] Akula, R. and C. Balaji, Thermal Performance of a Phase Change Material-Based Heat Sink Subject to Constant and Power Surge Heat Loads: A Numerical Study. Journal of Thermal Science and Engineering Applications, 2020. 13(3).
[66] Kalbasi, R., et al., Studies on optimum fins number in PCM-based heat sinks. Energy, 2019. 171: p. 1088-1099.
[67] Usman, H., et al., An experimental study of PCM based finned and un-finned heat sinks for passive cooling of electronics. Heat and Mass Transfer, 2018. 54(12): p. 3587-3598.
[68] Arshad, A., et al., An experimental study of enhanced heat sinks for thermal management using n-eicosane as phase change material. Applied Thermal Engineering, 2018. 132: p. 52-66.
[69] Arıcı, M., et al., Investigation on the melting process of phase change material in a square cavity with a single fin attached at the center of the heated wall★. Eur. Phys. J. Appl. Phys., 2018. 83(1): p. 10902.
[70] Ali, H.M., et al., Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison. International Journal of Heat and Mass Transfer, 2018. 117: p. 1199-1204.
[71] Arshad, A., et al., Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction. Applied Thermal Engineering, 2017. 112: p. 143-155.
[72] Ali, H.M., et al., Thermal management of electronics: An experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs. International Journal of Heat and Mass Transfer, 2018. 123: p. 272-284.
[73] Ashraf, M.J., et al., Experimental passive electronics cooling: Parametric investigation of pin-fin geometries and efficient phase change materials. International Journal of Heat and Mass Transfer, 2017. 115: p. 251-263.
[74] Brent, A.D., V.R. Voller, and K.J. Reid, ENTHALPY-POROSITY TECHNIQUE FOR MODELING CONVECTION-DIFFUSION PHASE CHANGE: APPLICATION TO THE MELTING OF A PURE METAL. Numerical Heat Transfer, 1988. 13(3): p. 297-318.
[75] Yang, Y.-T. and Y.-H. Wang, Numerical simulation of three-dimensional transient cooling application on a portable electronic device using phase change material. International Journal of Thermal Sciences, 2012. 51: p. 155-162.
[76] Wang, Y.-H. and Y.-T. Yang, Three-dimensional transient cooling simulations of a portable electronic device using PCM (phase change materials) in multi-fin heat sink. Energy, 2011. 36(8): p. 5214-5224.
[77] Shatikian, V., G. Ziskind, and R. Letan, Numerical investigation of a PCM-based heat sink with internal fins: Constant heat flux. International Journal of Heat and Mass Transfer, 2008. 51(5): p. 1488-1493.
[78] Nayak, K.C., et al., A numerical model for heat sinks with phase change materials and thermal conductivity enhancers. Int. J. Heat Mass Transf, 2006. vol. 49(null): p. 1833.
[79] Shatikian, V., G. Ziskind, and R. Letan, Numerical investigation of a PCM-based heat sink with internal fins. Int. J. Heat Mass Transf, 2005. vol. 48(null): p. 3689.
[80] Sahoo, S.K., P. Rath, and M.K. Das, Numerical study of phase change material based orthotropic heat sink for thermal management of electronics components. International Journal of Heat and Mass Transfer, 2016. 103: p. 855-867.
[81] Hosseinizadeh, S., F. Tan, and S. Moosania, Experimental and numerical studies on performance of PCM-based heat sink with different configurations of internal fins. Appl. Therm. Eng., 2011. 31(17–18): p. 3827.
[82] Fok, S.C., W. Shen, and F.L. Tan, Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks. Int. J. Thermal Sci, 2010. vol. 49(null): p. 109.
[83] Hosseini, M.J., M. Rahimi, and R. Bahrampoury, Experimental and computational evolution of a shell and tube heat exchanger as a PCM thermal storage system. International Communications in Heat and Mass Transfer, 2014. 50: p. 128-136.
[84] Kumar, A., et al., Experimental investigation on paraffin wax-based heat sinks with cross plate fin arrangement for cooling of electronic components. Journal of Thermal Analysis and Calorimetry, 2022. 147(17): p. 9487-9504.